封装/外壳：80-LQFP 包装：托盘 描述：IC DSP 24BIT 150MHZ 80-LQFP 集成电路（IC） DSP（数字信号处理器）

封装/外壳：80-LQFP 包装：托盘 描述：IC DSP 24BIT 150MHZ 80-LQFP 集成电路（IC） DSP（数字信号处理器）

56374 80LQFP AUTOMOTIVE

Freescale Semiconductor

文件：1.13005 Mbytes Page：64 Pages

a high-density CMOS device

Overview The DSP56374 is a high-density CMOS device with 3.3 V inputs and outputs. The DSP56374 supports digital audio applications requiring sound field processing, acoustic equalization, and other digital audio algorithms. The DSP56374 uses the high performance, single-clock-per-cycle DSP5

high density CMOS device with 3.3 V inputs and outputs

Overview The DSP56374 is a high density CMOS device with 3.3 V inputs and outputs. The DSP56374 supports digital audio applications requiring sound field processing, acoustic equalization, and other digital audio algorithms. The DSP56374 uses the high performance, single-clock-per-cycle DSP5

high density CMOS device with 3.3 V inputs and outputs

Overview The DSP56374 is a high density CMOS device with 3.3 V inputs and outputs. The DSP56374 supports digital audio applications requiring sound field processing, acoustic equalization, and other digital audio algorithms. The DSP56374 uses the high performance, single-clock-per-cycle DSP5

The DSP56374 is a high-density CMOS device with 3.3 V inputs and outputs.

文件：1.13611 Mbytes Page：64 Pages

The DSP56374 is a high-density CMOS device with 3.3 V inputs and outputs.