T1 Single-Chip Transceivers

DESCRIPTION The DS21352/552 T1 single-chip transceiver contains all of the necessary functions for connection to T1 lines whether they are DS1 long haul or DSX–1 short haul. The clock recovery circuitry automatically adjusts to T1 lines from 0 feet to over 6000 feet in length. The device can gene

3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers

DESCRIPTION The DS21352/552 T1 single-chip transceiver contains all of the necessary functions for connection to T1 lines whether they are DS1 long haul or DSX–1 short haul. The clock recovery circuitry automatically adjusts to T1 lines from 0 feet to over 6000 feet in length. The device can gene

封装/外壳：100-LQFP 功能：单芯片收发器 包装：托盘 描述：IC TELECOM INTERFACE 100LQFP 集成电路（IC） 电信

T1 Single-Chip Transceivers

DESCRIPTION The DS21352/552 T1 single-chip transceiver contains all of the necessary functions for connection to T1 lines whether they are DS1 long haul or DSX–1 short haul. The clock recovery circuitry automatically adjusts to T1 lines from 0 feet to over 6000 feet in length. The device can gene

3.3V DS21352 and 5V DS21552 T1 Single-Chip Transceivers

DESCRIPTION The DS21352/552 T1 single-chip transceiver contains all of the necessary functions for connection to T1 lines whether they are DS1 long haul or DSX–1 short haul. The clock recovery circuitry automatically adjusts to T1 lines from 0 feet to over 6000 feet in length. The device can gene

封装/外壳：100-LQFP 功能：单芯片收发器 包装：托盘 描述：IC TELECOM INTERFACE 100LQFP 集成电路（IC） 电信

T1/E1/J1 Single-Chip Transceiver

GENERAL DESCRIPTION The DS2155 is a software-selectable T1, E1, or J1 single-chip transceiver (SCT) for short-haul and long-haul applications. The DS2155 is composed of a line interface unit (LIU), framer, HDLC controllers, and a TDM backplane interface, and is controlled by an 8-bit parallel por

Intellimod??Module Dual-In-Line Intelligent Power Module (5 Amperes/600 Volts)

Description: DIP and mini-DIP IPMs are intelligent power modules that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 4th generation IGBTs, DIP packaging, and application specific