封装/外壳：模块 包装：托盘托盘 描述：IGBT MOD 1200V 140A 515W 分立半导体产品 晶体管 - IGBT - 模块

桥式整流器和交流开关

EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT

Mechanical Features •Al2O3 Substrate with Low Thermal Resistance • High Power Density • Isolated Base Plate • Compact design • PressFIT Contact Technology • RoHS compliant • Standard Housing

EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC

Mechanical Features •Al2O3 substrate with low thermal resistance • High power density • Isolated base plate • Compact design • PressFIT contact technology • RoHS compliant • Standard housing

EconoPACK?? Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und PressFIT

Electrical Features • Tvj op = 150°C Mechanical Features • Al₂O3 substrate with low thermal resistance • High power density • Isolated base plate • Compact design • PressFIT contact technology • RoHS compliant • Standard housing • Pre-applied Thermal Interface Material

EconoPACK?? Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und PressFIT

Electrical Features • Tvj op = 150°C Mechanical Features • Al₂O3 substrate with low thermal resistance • High power density • Isolated base plate • Compact design • PressFIT contact technology • RoHS compliant • Standard housing • Pre-applied Thermal Interface Material

桥式整流器和交流开关

封装/外壳：模块 包装：托盘 描述：LOW POWER ECONO AG-ECONO2B-411 分立半导体产品 晶体管 - IGBT - 模块

桥式整流器和交流开关