DIP REED RELAY

Features Molded epoxy body DIP type construction with the same terminal pitch as ICs or TTLs simplifies PC board designing. In addition, the high sensitivity allows direct driving by TTL, etc. •Automatic insertion compatible Sealed construction permits automatic flow soldering and clean

REED RELAY

Features 1. Molded epoxy body. 2. Dip type construction with the same terminal pitch as ICs or TTLs simplifies PC board designing. In addition, the high sensitivity allows direct driving by TTL, etc. 3. Automatic insertion compatible. 4. Sealed construction permits automatic flow solde

Dual Inline Pack Reed Relay

FEATURES Solid Epoxy Body Industry standard DIP spacing Completely sealed, Immersion cleanable Automatic insertion compatible Magnetic shield available Diode accross the coil available UL recognized and certified for Canada