Kingston DDR3/3L DRAM for embedded applications

KEY FEATURES • Double Data Rate (DDR) architecture: two data transfers per clock cycle • High-speed data transfer is realized by 8 bits prefetch pipelined architecture • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver

面向设备制造商的嵌入式 DRAM 组件

Kingston i-Temp DDR3/3L DRAM for embedded applications

KEY FEATURES • Double Data Rate architecture: two data transfers per clock cycle • High-speed data transfer is realized by 8 bits prefetch pipelined architecture • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver • DOS

Kingston DDR3/3L DRAM for embedded applications

KEY FEATURES • Double Data Rate (DDR) architecture: two data transfers per clock cycle • High-speed data transfer is realized by 8 bits prefetch pipelined architecture • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver

Kingston DDR3/3L DRAM for embedded applications

KEY FEATURES • Double Data Rate (DDR) architecture: two data transfers per clock cycle • High-speed data transfer is realized by 8 bits prefetch pipelined architecture • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver

Multi-channel data acquisition

Up to 16 unipolar analog input channels Up to 12-bit resolution with 0.5 accuracy Up to 4 software configurable digital output lines Up to 1 MS/s sample rate USB connected and powered Complete with ready-to-go data logging software Includes API and examples for C/C++/C#, VB, LabVIEW VIs

HIGH TEMPERATURE SERIES

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STANDARD SERIES

文件：241.69 Kbytes Page：1 Pages

HIGH TEMPERATURE SERIES

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Variable RF Inductor

文件：446.53 Kbytes Page：2 Pages