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CY7C1461AV33-100AXI中文资料

厂家型号

CY7C1461AV33-100AXI

文件大小

1141.5Kbytes

页面数量

31

功能描述

36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL??Architecture

数据手册

下载地址一下载地址二到原厂下载

简称

CYPRESS赛普拉斯

生产厂商

Cypress Semiconductor

中文名称

赛普拉斯半导体公司官网

CY7C1461AV33-100AXI数据手册规格书PDF详情

Functional Description[1]

The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 is a 3.3V, 1M x 36/2M x 18/512K x 72 Synchronous Flow -through Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states.

The CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 is equipped with the advanced No Bus Latency (NoBL) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data through the SRAM, especially in systems that require frequent Write-Read transitions.

Features

• No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles

• Can support up to 133-MHz bus operations with zero wait states

— Data is transferred on every clock

• Pin-compatible and functionally equivalent to ZBT™ devices

• Internally self-timed output buffer control to eliminate the need to use OE

• Registered inputs for flow-through operation

• Byte Write capability

• 3.3V/2.5V I/O power supply

• Fast clock-to-output times

— 6.5 ns (for 133-MHz device)

• Clock Enable (CEN) pin to enable clock and suspend operation

• Synchronous self-timed writes

• Asynchronous Output Enable

• CY7C1461AV33, CY7C1463AV33 available in

JEDEC-standard lead-free 100-pin TQFP package,

lead-free and non-lead-free 165-ball FBGA package.

CY7C1465AV33 available in lead-free and non-lead-free

209-ball FBGA package

• Three chip enables for simple depth expansion

• Automatic Power-down feature available using ZZ mode or CE deselect

• IEEE 1149.1 JTAG-Compatible Boundary Scan

• Burst Capability—linear or interleaved burst order

• Low standby power

更新时间:2025-11-1 16:44:00
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