位置:CY7C1316BV18-250BZC > CY7C1316BV18-250BZC详情

CY7C1316BV18-250BZC中文资料

厂家型号

CY7C1316BV18-250BZC

文件大小

257.709Kbytes

页面数量

24

功能描述

18-Mbit DDR-II SRAM 2-Word Burst Architecture

数据手册

下载地址一下载地址二到原厂下载

简称

CYPRESS赛普拉斯

生产厂商

Cypress Semiconductor

中文名称

赛普拉斯半导体公司官网

CY7C1316BV18-250BZC数据手册规格书PDF详情

Features

• 18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)

• 300-MHz clock for high bandwidth

• 2-Word burst for reducing address bus frequency

• Double Data Rate (DDR) interfaces

(data transferred at 600 MHz) @ 300 MHz

• Two input clocks (K and K) for precise DDR timing

— SRAM uses rising edges only

• Two input clocks for output data (C and C) to minimize

clock-skew and flight-time mismatches

• Echo clocks (CQ and CQ) simplify data capture in

high-speed systems

• Synchronous internally self-timed writes

• 1.8V core power supply with HSTL inputs and outputs

• Variable drive HSTL output buffers

• Expanded HSTL output voltage (1.4V–VDD)

• Available in 165-ball FBGA package (13 x 15 x 1.4 mm)

• Offered in both lead-free and non lead-free packages

• JTAG 1149.1-compatible test access port

• Delay Lock Loop (DLL) for accurate data placement

更新时间:2025-10-14 17:21:00
供应商 型号 品牌 批号 封装 库存 备注 价格
CYPRESS
25+
DIP-16
18000
原厂直接发货进口原装
CYPRESS
23+
QFP
20000
原厂授权代理分销现货只做原装正迈科技样品支持现货
CYPRESS
23+
BGA
5000
原装正品,假一罚十
CYPRESS
22+
BGA
2000
原装正品现货
CYPRESS
20+
165FBGA
11520
特价全新原装公司现货
CYPRESS
2138+
原厂标准封装
8960
代理CYPRESS全系列芯片,原装现货
CYPRESS
22+
BGA
8000
原装正品支持实单
CYPRESS
22+
null
4179
原装现货
CYPRESS
23+
null
8000
只做原装现货
CYPRESS
23+
null
7000