Features

- Glass passivated chip.

- Low leakage.

- Built-in strain relief.

- Low inductance.

- 3000W peak pulse power capability with a 10/1000μs

waveform, repetition rate (duty cycles): 0.01%.

- Excellent clamping capability.

- High temperature soldering:

260°C/40 seconds at terminals.

- Matte tin lead-free plated.

- Bidirectional unit.

- Very fast response time.

- IEC-61000-4-2 ESD 30kV (Air), 30kV (Contact).

- Typical maximum temperature coefficient

△VBR=0.1%xVBR@25°Cx△T