FEATURES

• Fully automated system with fab integration to provide a

complete solution to the customer

• High resolution optics combined with precision

mechanics to transfer smallest LEDs down to 5x5 μm²

• 28x1 mm² field size, 300 Hz rep rate and 300mm/s stage

speed for highest throughput

• Double receiver stage for high system for outstanding

system efficiency

• Triple donor stage for RGB generation in one process step

and to minimize loading times and to optimize the die-todie

placing accuracy or single tripod donor stage

to compensate wafer bow

• Outstanding SW features like digital twin and path

planning for process simulation and optimization

APPLICATIONS

• MicroLED mass transfer (pitch conversion and RGB pixel

generation) in the display production

- From an EpiWafer to a temporary carrier or backplane

- From a carrier to a second carrier or backplane