FEATURES

• Fully automated system with fab integration to provide a

complete solution to the customer

• High resolution optics combined with precision

mechanics to transfer smallest LEDs down to 5x5 μm²

• 25x10 mm² field size, 1000 Hz rep rate for highest process

speed

• Double receiver stage for high system for outstanding

system efficiency

• Triple donor stage for RGB generation in one process step

and to minimize loading times and to optimize the die-todie

placing accuracy or single tripod donor stage

to compensate wafer bow

• Outstanding SW features like digital twin and path

planning for process simulation and optimization,

processing according to imported error map

APPLICATIONS

• MicroLED repair process

• Remove defect microLEDs from the EpiWafer or

temporary carrier (substrate must be transparent for

UV light)

• Refill of missing microLED on a temporary carrier or

backplane