FEATURES & BENEFITS

• 1064 nm output

• 100 W power to enable high

throughput

• Over 1000 μJ burst energy to cut

thicker samples

• Specified burst mode operation for

repeatable performance in volume

manufacturing

• Compact and light weight, same

interfacing as standard HyperRapid NXT

to allow straightforward integration

• Right of use to the Coherent

SmartCleave IP is included

APPLICATIONS

• Cutting of strengthened and

unstrengthened glass, sapphire,

and ceramics

• Scribing and drilling of glass, sapphire,

ceramics, and composite materials