FEATURES

• Up to 1.25Gb/s bi-directional data links

• Hot-pluggable SFP footprint

• Extended case temperature range (-40°C to +85°C )

• Fully metallic enclosure for low EMI

• RoHS compliant and Lead Free

• Low power dissipation (1.05 W typical)

• Compact RJ-45 connector assembly

• Access to physical layer IC via 2-wire serial bus

• 10/100/1000 BASE-T operation in host systems with

SGMII interface

APPLICATIONS

• 1.25 Gigabit Ethernet over Cat 5 cable