Features and Benefits

• Selection of 157 nm, 193 nm,

248 nm, 308 nm, and 351 nm

wavelengths for full material

flexibility

• Superior pulse energy of up

to 750 mJ to enable effective

ablation at large field size

• Unrivalled pulse stability of

0.75%, rms to ensure high

fluence control

• Ultimate pulse control and

system parameter logging to

deliver smart and reproducible

thin films

Applications

• PLD – Pulsed Laser Deposition

• Thin Wafer Processing

• Laser Lift-Off/Debonding

• LA-ICP-MS