Features and Benefits

• Repetition rates single-shot to

100s of kHz

• High beam quality M² <1.2

• Industry leading compact footprint

• Simplified user interface at

laser head

• High reliability between long

maintenance cycles

Applications

• Via Hole Drilling

• Flex Materials Cutting

• 3D Package Manufacturing

• IC Package Trimming

• Wafer Scribing and Singulation

• Solar Cell Scribing

• PCB Cutting

• 5G LCP Processing

• High Speed Marking

• Glass Drilling

• Wafer Planarization

• SIP Cutting