description

The CLE400F can contain three 850 nm IRED chips which feature double/double heterojunction (DDH) construction for increased quantum efficiency and reliability. This device is one example of a very broad line of devices made possible by four leaded package configuration. One to three chips can be attached. Multiple chip devices can be series or parallel connected.

features

• ±70° emission angle

• wide variety of chip combinations

• wide variety of lenses and apertures