位置：CL1570ESD > CL1570ESD详情
CL1570ESD中文资料
CL1570ESD数据手册规格书PDF详情
Features
◆Built-in high-voltage startup power supply
◆±4% LED output current accuracy
◆Output current externally adjustable: 5mA~60mA
◆Internally integrated 450V power tube
◆No transformer required
◆Over-temperature regulation function
◆Simple peripheral circuits, few components
◆Chip can be directly soldered on aluminum substrate
◆No EMI problem in system application
Application range
◆LED ceiling lamp
◆LED bulb
◆T5/T8 series LED fluorescent tube
◆Other LED lighting
CL1570 adopts TO-252-2L, ESOP8 and
SOT-89-3L package
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
CHIPLINK |
22+ |
SOP-8 |
30000 |
十七年VIP会员,诚信经营，一手货源，原装正品可零售！ |
|||
CHIPLINK |
20+ |
SOP-8 |
60000 |
原装现货支持BOM配单服务 |
|||
CHIPLINK |
24+ |
SOP-8 |
39500 |
进口原装现货 支持实单价优 |
|||
CHIPLINK |
24+ |
SOP-8 |
880000 |
明嘉莱只做原装正品现货 |
|||
CHIPLINK |
23+ |
SOP8 |
110232 |
全新原装正品现货,支持订货 |
|||
CHIPLINK |
20+ |
SOP8 |
110232 |
进口原装现货,假一赔十 |
|||
CHIPLINK |
21+ |
SOP8 |
110232 |
原装现货假一赔十 |
|||
CHIPLINK |
24+ |
SOP8 |
23000 |
只做正品原装现货 |
|||
CHIPLINK/芯联 |
24+ |
SOP8 |
60000 |
||||
CHIPLINK/芯联 |
24+ |
ESOP-8 |
30000 |
芯联一级代理原装现货 |
CL1570ESD 资料下载更多...
CL1570ESD 芯片相关型号
- 1252055
- 3036288
- 542252
- 542253
- 542254
- AC1206FK-1097R6L
- AC1206FK-109R76L
- AC1206FK-13976R
- AC1206FK-1397R6
- AC1206FK-1397R6L
- AC1206FK-139K76
- AC1206FK-139M76
- AC1206FK-139R76
- AC1206FK-139R76L
- AC1206FK-7W100R
- CL1570
- CL1570EDK
- EC002635
- HF115F-ASLASH115-1DS2BFXXX
- HF115F-ASLASH115-1DS2BGFXXX
- HF115F-ASLASH115-1DS2FXXX
- HF115F-ASLASH115-1DS2GFXXX
- HF115F-ASLASH115-1DS3AFXXX
- HF115F-ASLASH115-1DS3BFXXX
- HUS-75FG-12
- HUS-75FG-15
- HUS-75FG-24
- HUS-75FG-48
- HUS-75FG-5
- HUS-75FG-XX
CHIPLINK相关芯片制造商
Datasheet数据表PDF页码索引
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CHIPLINK SEMICONDUCTOR 南京市智凌芯科技股份有限公司
中文资料: 11条
南京市智凌芯科技股份有限公司（CHIPLINK SEMICONDUCTOR）是一家专注于提供高性能半导体解决方案的公司，致力于开发创新的集成电路（IC）和应用特定集成电路（ASIC）以满足汽车、消费电子、通信和工业等多个市场的需求。公司通过强大的研发团队和先进的技术平台，不断推动产品性能和效率的提升，以适应快速变化的市场环境。CHIPLINK SEMICONDUCTOR为多个行业的客户提供定制化的解决方案，力求在品质、可靠性和服务方面超越客户期望，从而增强其在全球半导体行业中的竞争力。
