FEATURES

• For surface mounted applications in order to optimize board space

• Low profile package

• Built-in strain relief

• Glass passivated junction

• Low inductance

• Excellent clamping capability

• Repetition Rate (duty cycle):0.5

• Fast response time: typically less then 5.0 ns from 0 volts to BV for bidirectional types

• Typical ID less then 1 μA above 10V

• High tempreature soldering:250°C/10 seconds at terminals

• Plastic package has Underwriters Laboratory Flammability Classification 94V-O