Features

•Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.

•Low profile surface mounted application in order to optimize board space.

•Low power loss, high efficiency.

•High current capability, low forward voltage drop.

•High surge capability.

•Guardring for overvoltage protection.

•Ultra high-speed switching.

•Silicon epitaxial planar chip, metal silicon junction.

•Lead-free parts meet environmental standards of MIL-STD-19500 /228

• Suffix -H indicates Halogen-free parts, ex. FM120-H.

Mechanical data

• Epoxy:UL94-V0 rated flame retardant

• Case : Molded plastic,DO-214AC / SMA-F

• Terminals : Solder plated, solderable per MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.05 gram