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SW140255中文资料

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SW140255

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Soder-Wick Lead-Free Desoldering Braid

数据手册

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SW140255数据手册规格书PDF详情

Product Description

Soder-Wick Lead-Free is the state of the art in desoldering

technology. It is specially designed for removal of today’s high

temperature lead-free solders. The single layer weave used for

Soder-Wick Lead-Free braid is lighter in mass than any other

desoldering braid available and allows for lead-free solder

removal at lower temperatures. Soder-Wick Lead-Free

responds faster than any other conventional desoldering braid.

This unique design minimizes overheating and requires less

“contact” time thus preventing heat damage to the PCB and

sensitive components. For Lead-Free rework, Soder-Wick has

the answer.

● Fastest wicking and heat transfer

● High capacity for solder uptake

● Halide free, no corrosive residues

● Minimizes risk of heat damage to pads, components and

PBCs

● Can be used with Tin/Lead solders

● RoHS compliant

Typical Applications

Soder-Wick Lead-Free desoldering braid safely removes solder

from:

● Thru-hole Components

● SMT Pads and BGA Pads

● Micro Circuits

● Terminals, Lugs and Posts

● Identification Script

Usage Instructions

For industrial use only. Read SDS carefully prior to use.

1) Choose a Soder-WickÒ Lead-Free braid width equal to

or slightly larger than the pad or connection.

2) Choose a solder iron tip equal to or slightly larger than

the pad or connection.

3) Set temperature of iron between 600-750°F.

4) Place wick on solder joint and place tip of hot iron on

top of wick.

5) As solder becomes molten, the color of the wick will

change from copper to silver.

6) Remove wick and iron from joint simultaneously once

color change has stopped.

7) The component lead / pad is now clean and free from

solder.

8) Clip and discard used portion of the wick

9) If needed, clean PCB with CircuitWorks Lead-Free Flux

Remover Pen CW9400 and remove soils with a

ControlWipes absorbent wipe.

Soder-Wick Is Designed To Meet or Exceed the

Following:

● MIL-F-14256F, Type R

● NASA-STD-8739.3

● DOD-STD-883E, Method 2022

● ANSI/IPC J STD-004, Type ROL0

● BELLCORE TR-NWT-000078

● ANSI/IPC J SF-818

Soder-Wick Bobbins Are Designed To Meet or

Exceed:

● MIL-STD-2000A

● MIL-B-81705C

● MIL-STD-1686C

● MIL-HDBK-263B

● ANSI/IPC J SF-818

更新时间:2025-12-3 16:06:00
供应商 型号 品牌 批号 封装 库存 备注 价格
SOURCE
2
全新原装 货期两周
Silicon
24+
BGA
2000
原装现货,可开13%税票
Silicon
25+
BGA
2000
百分百原装正品 真实公司现货库存 本公司只做原装 可
原厂原装
ROHS
13352
一级代理 原装正品假一罚十价格优势长期供货
WESTCODE
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
WESTCODE
24+
MODULE
2100
公司大量全新现货 随时可以发货
WESTCODE/西码
2023+
MODULE
26
主打螺丝模块系列
WESTCODE/西码
23+
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
WESTCODE
23+
标准封装
5000
原厂授权一级代理 IGBT模块 可控硅 晶闸管 熔断器质保
WESTCODE
24+
MODULE
1000
全新原装现货