Product Description

Soder-Wick No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static

lectricity.

§ Requires little or no post solder cleaning

§ No corrosive residues

§ Halide free

§ ESD Safe bobbins meet specs:

MIL-STD-1686C

MIL-HDBK-263B

Static decay provision of MIL-B-81705C

§ Minimal risk of heat and static component damage

Typical Applications

Soder-Wick No Clean safely removes solder from:

§ Lugs and Posts

§ Micro Circuits

§ Surface Mount Device Pads

§ Ball Grid Array Pads