Product Description

Soder-Wick® offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.

Soder-Wick Rosin has the fastest desoldering action in the industry. Flux residues must be cleaned after the rework process.

Typical Applications

Soder-Wick® desoldering braid safely removes solder from:

§ Thru-hole Components

§ SMT Pads and BGA Pads

§ Micro Circuits

§ Terminals

§ Lugs and Posts

§ Identification Script