PRODUCT DESCRIPTION

Chem-Wik Rosin is especially designed for today’s heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik Rosin responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less “contact” pressure for greater operator control. All sizes are coated with a Type “R” organic flux system.

 Requires little or no post solder cleaning

 No corrosive residues

 Optimized weave design for faster wicking and heat transfer

 Halide free

 Minimal risk of heat damage to components and circuit boards

TYPICAL APPLICATIONS

Chem-Wik Rosin desoldering braid safely removes solder from:

 Thru-hole Components

 Surface Mount Device Pads

 BGA Pads

 Micro Circuits

 Terminals

 Lugs and Posts

 Identification Script