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CPD30V数据手册规格书PDF详情
Dual Switching Diode
Dual, Common Cathode, High Speed Switching Diode Chip
PROCESS DETAILS
Die Size 15.4 x 15.4 MILS
Die Thickness 7.1 MILS
Anode 1 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS
Anode 2 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au-As - 10,000Å
更新时间：2025-10-13 14:09:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Central Semiconductor Corp |
25+ |
模具 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
24+ |
N/A |
64000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
CODACA/科达嘉 |
25+ |
DIP |
10000 |
||||
ACER |
23+ |
TSSOP-50 |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
ACER |
24+ |
TSSOP-50 |
23000 |
只做正品原装现货 |
|||
ACER |
2450+ |
TSSOP |
9850 |
只做原厂原装正品现货或订货假一赔十! |
|||
ACER |
24+ |
TSSOP |
3020 |
||||
ACER |
24+ |
TSSOP |
3500 |
原装现货,可开13%税票 |
|||
FLUOROCARBONCO |
新 |
7665 |
全新原装 货期两周 |
||||
CP |
2015+ |
SOP |
19889 |
一级代理原装现货,特价热卖! |
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