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QCA9377中文资料

厂家型号

QCA9377

文件大小

142.71Kbytes

页面数量

1

功能描述

Supports Multiple HW/OS Platforms to Deliver Connectivity in HARSH ENVIRONMENTS

数据手册

下载地址一下载地址二

生产厂商

CEL

QCA9377数据手册规格书PDF详情

Based on Qualcomm’s QCA9377, the CMP9377 is a multi-protocol connectivity module delivering the optimal combination of high performance and low power connectivity. The highly integrated module provides dual-band, single stream 802.11 ac plus Bluetooth v5.0. Support for high-speed Wi-Fi connectivity can deliver enriched media experiences for a variety of connected devices while optimized for energy efficiency to extend the usable battery life of portable devices. Offering advanced WLAN/Bluetooth coexistence algorithms, the CMP9377 supports superior rate-over-range throughput and low-latency performance in real-world RF operating conditions.

The integrated CPU manages the Wi-Fi stack to minimize resource requirements on your host platform. The low-level Bluetooth stack runs onboard with a Host Control Interface (HCI) to your host platform running the user-selected Bluetooth stack and profile combination. Support for all Bluetooth profiles and BLE services is integrated.

KEY FEATURES

• 802.11 a/b/g/n/ac Wave 2 MU-MIMO

o Dual-Band Wi-Fi support (2.4 GHz / 5 GHz)

o Integrated Coexistence Manager

o Dedicated CPU for WLAN stack

o 20/40/80 MHz channel support

o MU-MIMO, Transmit Beamforming (PCIe only)

o Pout of 18 dBm

• Bluetooth v5.0 Smart Ready

o Host Control Interface (HCI)

o Pout of 8 dBm (Bluetooth)

o Pout of 4 dBm (BLE)

• Wireless Coexistence

o Concurrent Wi-Fi and BLE

o Per-Packet Coexistence Manager

• Power Management Features

o Single 3.3V Regulated Supply

o Clock Gating to idle blocks

o Processor Frequency Scaling

• WLAN Interface Options (Versions not pin compatible)

o SDIO (CMP9377-Sx)

o USB v2.0 (CMP9377-Ux)

o PCIe (CMP9377-P)

• Bluetooth Interface Options

o UART (CMP9377-Sx)

o USB (CMP9377-Ux; CMP9377-P)

• Antenna Options

o Integrated dual-band chip

o RF Connector (I-PEX MHF4 P/N 20449-001E)

• Compact Form Factor

o 17 x 12 x 3 mm (CMP9377-SC/UC)

o 24 x 12 x 3 mm (CMP9377-SA/UA)

o 30 x 16.5 mm M.2 (CMP9377-P)

• Operating Temperature: -40° C to +85°C

• Certifications

o FCC

o IC

o CE RED

HOST DRIVER SUPPORT

• Source Code available for multiple HW/OS reference platforms:

o Android

o Linux

o Windows

• Platform Porting Options

o Porting Guides available

o Custom driver development available through Engineering Services contract

更新时间:2025-10-12 14:10:00
供应商 型号 品牌 批号 封装 库存 备注 价格
QUALCOMM
23+
BGA
65400
DNA
16
公司现货,有挂就有货。
QUALCOMM/高通
23+
BGA
15000
一级代理原装现货
QUALCOMM/高通
2447
BGA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
Qualcomm(高通)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
QUALCOMM/高通
25+
BGA
10000
原厂原装,价格优势
QUALCOMM/高通
23+
QFN
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
QUALCOMM/高通
24+
BGA
9000
只做原装正品 有挂有货 假一赔十
QUALCOM
16+
BGA
24
原装
QUALCOMM高通
24+
BGA
10000
只有原装