封装/外壳：20-TSSOP（0.173"，4.40mm 宽） 包装：卷带（TR）剪切带（CT） 描述：IC CLOCK SSCG EMI 20-TSSOP 集成电路（IC） 时钟发生器，PLL，频率合成器

封装/外壳：20-TSSOP（0.173"，4.40mm 宽） 包装：卷带（TR）剪切带（CT） 描述：IC CLOCK SSCG EMI 20-TSSOP 集成电路（IC） 时钟发生器，PLL，频率合成器

IC CLOCK SSCG EMI 20-TSSOP

Pentium 4 Processors Supporting Hyper-Threading Technology

Introduction The Intel® Pentium® 4 processor on 90 nm process in the 775-land package is a follow on to the Pentium 4 processor in the 478-pin package with enhancements to the Intel NetBurst® microarchitecture. The Pentium 4 processor on 90 nm process in the 775-land package uses FlipChip Land Gr

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

PISTON SEALS

DESCRIPTION The BECA 530 profile is a double acting composite piston seal composed of a pre-tightened rubber square ring and a specific polyurethane friction ring. APPLICATIONS Agriculture Light and medium-sized industry Machine tools Material handling/Lifting

Intel짰 Solid-State Drive 530 Series (2.5-inch)

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