封装/外壳：2010（5025 公制） 包装：卷带（TR） 描述：RES 0.01 OHM 1% 1W 2010 电阻器 片式电阻器 - 表面贴装

封装/外壳：2010（5025 公制） 包装：卷带（TR） 描述：RES 0.01 OHM 1% 1W 2010 电阻器 片式电阻器 - 表面贴装

MetalPlateCurrentSensingChipResistor

Features: •Metalelementcurrentsensingresistor •Highpowercurrentsenseresistor •TCRof±50ppm/C •Resistancesdownto0.0005(1/2mΩ) •Currenthandlingupto63amps •Non-standardresistancevaluesavailable •100RoHScompliantandleadfreewithoutexemption •Halogenfree •

FoilonCeramicCurrentSensingChipResistor

Features: •Highpowerrating •Wideresistancerange •Currenthandlingupto26amps •TCRdownto±50ppm/C •Otherresistancevaluesmaybeavailable •100RoHScompliantandleadfreewithoutexemption •Halogenfree •REACHcompliant

Anti-sulfurMetalFilmLowResistanceChipResistor

Features: •Lowresistance/TCR/inductance •Highprecisioncurrentsensing •Highpowercapability •Sulfurresistant •AEC-Q200qualified •100RoHScompliantandleadfreewithoutexemption •Halogenfree •REACHcompliant Applications: •Consumerelectronics •Computers •Telecom

ThinFilmCurrentSensingResistor

Features: •0201to2512(standardterminations)and 0612to1225(wideterminations)available •Lowresistance,TCRandinductance •Excellentlong-termstability •Highprecisioncurrentsensing •Highpowercapability •“-UP”Highpowerversion •Non-standardresistancevaluesavailabl