Programmable Unijunction Transistor

PROCESS DETAILS Process PLANAR PASSIVATED Die Size 27.5 x 27.5 MILS Die Thickness 11 MILS Anode Bonding Pad Area 7.1 x 5.1 MILS Cathode Bonding Pad Area 7.1 x 5.1 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 13,000Å

Programmable Unijunction Transistor

包装：盒 描述：OSCILLOSCOPE CURRENT PROBE 300KH 测试与计量 设备 - 电气检测仪、电流探头

包装：盒 描述：OSCILLOSCOPE CURRENT PROBE 300KH 测试与计量 设备 - 电气检测仪、电流探头

Chip Form: Programmable UJT

Silicon Rectifier, General Purpose, High Voltage, Fast Recovery (Surface Mount)

Features: High Temperature Metallurgically Bonded Glass Passivated Junction High Temperature Soldering Guaranteed: +450°C/5 Seconds at Terminals. Complete Device Submersible Temperature of +260°C/10 Seconds in Solder Bath.

8/16-Bit Micros

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LOW COST, SINGLE TRIP POINT TEMPERATURE SENSOR

GENERAL DESCRIPTION The TC622 and TC624 are programmable solid state temperature switches designed to replace mechanical switches in sensing and control applications. Both devices integrate the temperature sensor along with a voltage reference and all required detector circuitry to form a stand-a

LOW COST, SINGLE TRIP POINT TEMPERATURE SENSOR

GENERAL DESCRIPTION The TC622 and TC624 are programmable solid state temperature switches designed to replace mechanical switches in sensing and control applications. Both devices integrate the temperature sensor along with a voltage reference and all required detector circuitry to form a stand-a

LOW COST, SINGLE TRIP POINT TEMPERATURE SENSOR

GENERAL DESCRIPTION The TC622 and TC624 are programmable solid state temperature switches designed to replace mechanical switches in sensing and control applications. Both devices integrate the temperature sensor along with a voltage reference and all required detector circuitry to form a stand-a