Small Signal Transistor PNP - Amp/Switch Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 19 x 19 MILS Die Thickness 5.9 MILS Base Bonding Pad Area 3.5 x 4.3 MILS Emitter Bonding Pad Area 3.5 x 4.5 MILS Top Side Metalization Al

Small Signal Transistor PNP - Amp/Switch Transistor Chip

PNP - General Purpose Transistor Die

The CP591X-2N2907A is a silicon PNP transistor designed for general purpose applications. MECHANICAL SPECIFICATIONS: Die Size 19.3 x 19.3 MILS Die Thickness 5.9 MILS Base Bonding Pad Size 3.5 x 4.3 MILS Emitter Bonding Pad Size 3.5

PNP - General Purpose Transistor Die 0.6 Amp, 60 Volt

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Chip Form: Amplifier/Switch Transistor

Chip Form: Amplifier/Switch Transistor

P-Channel JFET Die

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封装/外壳：模具 包装：散装 描述：TRANS PNP 60V 0.6A DIE 1=400 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

PNP - High Voltage Transistor Die

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封装/外壳：模具 包装：散装 描述：TRANS PNP 60V 0.6A DIE 1=20PCS 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

3M™ Polishing Films

Product Description 3M™ Polishing Films 291X, 298X, 491X, 498X, 591X and 598X are comprised of micron graded mineral that has been coated onto a fibrous backing. Designed to break down into a slurry during use with water. Applications • MT fiber optic connector polishing and wafer edge cleani

1 ps MAX JITTER CRYSTAL OSCILLATOR (XO) (10 MHZ TO 810 MHZ)

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Solid Tantalum Chip Capacitors

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Solid Tantalum Chip Capacitors TANTAMOUNT, Low Profile, Low ESR, Conformal Coated, Maximum CV

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Solid Tantalum Chip Capacitors TANTAMOUNT® , Low Profile, Low ESR, Conformal Coated, Maximum CV

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