Small Signal MOSFET Transistor N-Channel Enhancement-Mode Transistor Chip

PROCESS DETAILS Die Size 15.7 x 15.7 MILS Die Thickness 3.9 MILS Gate Bonding Pad Area 3.9 x 3.9 MILS Source Bonding Pad Area 9.1 x 8.1 MILS Top Side Metalization Al-Si - 35,000Å Back Side Metalization Au - 12,000Å

uP Compatible Multiplying Quad 12-Bit D/A Converter

PRODUCT DESCRIPTION The AD394 contains four 12-bit, high-speed, low power, voltage output, multiplying digital-to-analog converters in a compact 28-pin hybrid package. The design is based on a proprietary, latched, 12-bit, CMOS DAC chip, which reduces chip count and provides high reliability. The

Up-Compatible Multiplying Quad 12-Bit D/A Converter

PRODUCT DESCRIPTION The AD394 contains four 12-bit, high-speed, low power, voltage output, multiplying digital-to-analog converters in a compact 28-pin hybrid package. The design is based on a proprietary, latched, 12-bit, CMOS DAC chip, which reduces chip count and provides high reliability. The

uP Compatible Multiplying Quad 12-Bit D/A Converter

PRODUCT DESCRIPTION The AD394 contains four 12-bit, high-speed, low power, voltage output, multiplying digital-to-analog converters in a compact 28-pin hybrid package. The design is based on a proprietary, latched, 12-bit, CMOS DAC chip, which reduces chip count and provides high reliability. The

3M??Vent Tape 394

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Carbon Composition Molded OD/OF Series (5 Tol.) OA Series (10)

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