Ethernet protocol stack chip

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以太网协议栈芯片

Card Edge Connectors 0.100” (2.54mm) Pitch

Features: • 0.100” (2.54mm) contact spacing x 0.200” (5.08mm) row spacing • Accepts 0.062” (1.57mm) nominal thickness P.C. board • High profile insulator body, 0.600” (15.24mm) • Contact termination options include P.C. tail, wire wrap, 90 degree bends and extender board bends • Single or dua

395-ISA Series Card Edge Connector | 0.100 (2.54mm) Pitch | 0.200 (5.08mm) Row Spacing | ISA Standards | 0.600 (15.24mm) Insulator Height

Features For IBM-AT Industry Standard Architecture .100 (2.54mm) Contact Spacing x .200 (5.08mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Divided in Groups of 62 and 36 Contacts Contact Termination Options include P.C. Tail, Wi

SUBMINIATURE FUSES

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Carbon Composition Molded OD/OF Series (5 Tol.) OA Series (10)

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Voltage rating up to 1600V

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