功率电感

• Ferrite core construction\n• L×W×H: 3.2×3.2×1.5mm Max.\n• Moisture Sensitivity Level: 1\n• Storage temperature range: -40℃～+105℃\n• 2000pcs per reel\n• DC/DC converter for CPU in notebook PC, smartphones, LCD displays, HDDs, DVDs,SSDs, DVCs, DSCs, PDAs etc.;

功率电感

• Ni-Zn ferrite magnetic material\n• High current carrying capacity \n• High power density, low core loss\n• Magnetically semi-shielded\n• Resin shielded for lower EMI \n• L×W×H:3.2×3.2×1.5mm Max.\n• Product weight: 0.05g(Ref.)\n• Moisture Sensitivity Level: 1 \n• AEC-Q200 partially pass\n• Operatin;

功率电感

• Ni-Zn ferrite magnetic material\n• High current carrying capacity \n• High power density, low core loss\n• Magnetically semi-shielded\n• Resin shielded for lower EMI \n• L×W×H:3.2×3.2×1.5mm Max.\n• Product weight: 0.05g(Ref.)\n• Moisture Sensitivity Level: 1 \n• AEC-Q200 partially pass\n• Operatin;

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

1 WATT CAPABILITY WITH PROPER HEAT SINKING

• 1N3016B THRU 1N3045B AVAILABLE IN JANHC PER MIL-PRF-19500/115 • 1 WATT CAPABILITY WITH PROPER HEAT SINKING • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW

封装/外壳：模具 包装：卷带（TR） 描述：VOLTAGE REGULATOR 分立半导体产品 二极管 - 齐纳 - 单

封装/外壳：模具 包装：卷带（TR） 描述：VOLTAGE REGULATOR 分立半导体产品 二极管 - 齐纳 - 单

HIGH EFFICIENCY RECTIFIERS(3.0A,50-400V)

High Efficiency Rectifiers

Operational Amplifiers

A general purpose operational amplifier that allows the user to choose the compensation capacitor best suited to his needs. With proper compensation, summing amplifier slew rates to 10 V/µs can be obtained. • Low Input Offset Current: 20 nA Maximum Over Temperature Range • External Frequency Com

Operational Amplifiers

A general purpose operational amplifier that allows the user to choose the compensation capacitor best suited to his needs. With proper compensation, summing amplifier slew rates to 10 V/µs can be obtained. • Low Input Offset Current: 20 nA Maximum Over Temperature Range • External Frequency Com

Operational Amplifiers

A general purpose operational amplifier that allows the user to choose the compensation capacitor best suited to his needs. With proper compensation, summing amplifier slew rates to 10 V/µs can be obtained. • Low Input Offset Current: 20 nA Maximum Over Temperature Range • External Frequency Com

30 VOLTS SILICON HOT.CARRIER DETECTOR AND SWITCHING DIODES

These devices are designed primarily for high–efficiency UHF and VHF detector applications. They are readily adaptable to many other fast switching RF and digital applications. They are supplied in an inexpensive plastic package for low–cost, high–volume consumer and industrial/commercial requirem