型号 功能描述 生产厂家 企业 LOGO 操作
CC1350F128RSM

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350F128RSM

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:管件 描述:IC RF TXRX+MCU BLUETOOTH 32VFQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

封装/外壳:32-VFQFN 裸露焊盘 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:IC RF TXRX+MCU BLE 4.2 32VQFN RF/IF,射频/中频和 RFID 射频收发器 IC

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:1.0034 Mbytes Page:61 Pages

TI

德州仪器

SimpleLink Ultra-Low-Power Dual-Band Wireless MCU

文件:799.63 Kbytes Page:52 Pages

TI

德州仪器

更新时间:2025-12-17 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
QFN32EP(4x4)
1083
只做原装,提供一站式配单服务,代工代料。BOM配单
TI(德州仪器)
24+
QFN32EP(4x4)
1652
原装现货,免费供样,技术支持,原厂对接
Texas Instruments
24+
VQFN-32
3265
全新原厂原装,进口正品现货,正规渠道可含税!!
Texas Instruments
20+
VQFN-32
29860
TI微控制器MCU-可开原型号增税票
TI
23+
QFN32
12800
正规渠道,只有原装!
TI
23+
NA
20000
TI
22+
5000
只做原装鄙视假货15118075546
TI(德州仪器)
23+
VQFN-32(4x4)
13650
公司只做原装正品,假一赔十
TI
23+
QFN32
5000
全新原装,支持实单,非诚勿扰
TI
24+
QFN32
30000
原装正品公司现货,假一赔十!

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