SILICON BRIDGE RECTIFIER

DESCRIPTION: The CENTRAL SEMICONDUCTOR CBR10, CBR25, CBR35 series tyep are silicon single phase full wave bridge rectifiers designed for general purpose applications. The molded epoxy case has a built-in metal baseplate for heat sink mounting. The plastic material is covered by UL flammability cl

SILICON BRIDGE RECTIFIERS

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Through-Hole Rectifier-Bridge General Purpose

SURFACE MOUNT GLASS PASSIVATED JUNCTION RECTIFIER

FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ For surface mount applications ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ High temperat

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App

DX SERIES HIGH-DENSITY I/O CONNECTORS

General DX series high-density I/O connector with bellow contacts are perfect for tomorrows miniaturized electronic devices. This new 1.27 mm (0.050) interconnect design enusres positive locking, effortless coupling, terminal protection and EMI reduction in a miniaturized and rugged package. App