MULTILAYER CERAMIC CHIP CAPACITORS

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封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CAP CER 150PF 50V C0G 0603 电容器 陶瓷电容器

封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CAP CER 150PF 50V C0G 0603 电容器 陶瓷电容器

积层贴片陶瓷片式电容器

Multilayer Ceramic Chip Capacitors

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Multilayer Ceramic Chip Capacitors

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Ceramic Capacitors For General Use SMD

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc

AT90USB1287 (AVR) 64 QFN device (2.7V VCC 5.5V)

Overview This document describes the AT88CK109STK3, which is a development kit for the AT88SA100, AT88SA102, and ATSA8810HS CryptoAuthentication devices. This kit uses a modular approach. The development kit includes the AT88Microbase board and the AT88CK109BK3 CryptoAuthentication daughter board

Ceramic Capacitors For General Use SMD

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de

Multilayer Ceramic Chip Capacitors General use

Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc