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C1608C0G1H0R5C价格
参考价格：￥0.0287
型号：C1608C0G1H0R5C080AA 品牌：TDK 备注：这里有C1608C0G1H0R5C多少钱，2025年最近7天走势，今日出价，今日竞价，C1608C0G1H0R5C批发/采购报价，C1608C0G1H0R5C行情走势销售排行榜，C1608C0G1H0R5C报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
C1608C0G1H0R5C | CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 |  |   |
C1608C0G1H0R5C | MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1H0R5C | MultilayerCeramicChipCapacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1H0R5C | MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1H0R5C | CeramicCapacitorsForGeneralUseSMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1H0R5C | MultilayerCeramicChipCapacitors 文件：173.01 Kbytes Page：31 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1H0R5C | MultilayerCeramicChipCapacitors 文件：173.01 Kbytes Page：31 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57112 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57112 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors 文件：129.75 Kbytes Page：1 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.74951 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors 文件：177.09 Kbytes Page：3 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitorsGeneraluse Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
GeneralApplication 文件：1.3923 Mbytes Page：72 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1H0R5C产品属性
- 类型
描述
- 型号
C1608C0G1H0R5C
- 功能描述
多层陶瓷电容器MLCC - SMD/SMT 0603 0.5pF 50V C0G 0.25pF
- RoHS
否
- 制造商
American Technical Ceramics(ATC)
- 电容
10 pF
- 容差
1 %
- 电压额定值
250 V
- 温度系数/代码
C0G(NP0) 外壳代码 -
- in
0505 外壳代码 -
- mm
1414
- 工作温度范围
- 55 C to + 125 C
- 产品
Low ESR MLCCs
- 封装
Reel
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK |
23+ |
SMD |
8560 |
受权代理!全新原装现货特价热卖! |
|||
TDK |
23+ |
0603 |
8000 |
专注配单,只做原装进口现货 |
|||
TDK |
23+ |
0603 |
8000 |
专注配单,只做原装进口现货 |
|||
TDK |
23+ |
[ 0603] |
7000 |
||||
TDK |
12000 |
原装正品 |
|||||
TDK |
24+ |
0603 |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
TDK |
24+ |
0603 |
4000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
TDK |
24+ |
103280 |
|||||
TDK |
21+ |
SMD |
4000 |
原装现货假一赔十 |
|||
25+ |
SMD |
865000 |
原装现货-全新批次-实时报价-以当天价格为准 |
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C1608C0G1H0R5C规格书下载地址
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C1608C0G1H0R5C数据表相关新闻
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C14D32P-A3P
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C14D16N-C3P
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C1608X5R1E105K080AC
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C1608C0G1H332J080AA产品技术参数资料品牌TDK
2020-6-13C1608C0G1E682J080AA产品技术参数 原装正品现货
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2020-6-13C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
2020-4-3
DdatasheetPDF页码索引
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