位置：首页 > IC中文资料第1693页 > C100
C100晶体管资料
C100别名：C100三极管、C100晶体管、C100晶体三极管
C100生产厂家：印度大陆器件公司
C100制作材料：Ge-PNP
C100性质：通用型 （Uni）
C100封装形式：
C100极限工作电压：50V
C100最大电流允许值：1A
C100最大工作频率：<1MHZ或未知
C100引脚数：
C100最大耗散功率：0.75W
C100放大倍数：
C100图片代号：NO
C100vtest：50
C100htest：999900
- C100atest：1
C100wtest：0.75
C100代换 C100用什么型号代替：
C100价格
参考价格：￥381.3077
型号：C100 品牌：Fluke 备注：这里有C100多少钱，2025年最近7天走势，今日出价，今日竞价，C100批发/采购报价，C100行情走势销售排行榜，C100报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
C100 | 封装/外壳：85-LFBGA 包装：托盘 描述：5MP H.265 USB VIDEO PROCESSOR - 集成电路（IC） DSP（数字信号处理器） | LUMISSIL |   | |
C100 | Thermometrics temperature sensor solutions 文件：1.44125 Mbytes Page：16 Pages | AMPHENOL 安费诺 | | |
C100 | SILICON PLANAR EPITAXIAL TRANSISTORS 文件：88.54 Kbytes Page：4 Pages | CDIL | | |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Overview KEMET’s C0G dielectric features a 125°C maximum operating temperature and is considered “stable.” The Electronics Components, Assemblies & Materials Association (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating a | KEMETKEMET Corporation 基美 | | ||
Process C1004 Process C1004 CMOS 1.0µm 5 Volt Digital | IMPIMP, Inc 林屹微电子林屹微电子(宁波)有限公司 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Commercial grade, general (Up to 75V) ■SERIES OVERVIEW General type C series is a surface-mounted component, which multilayer dielectrics and inner electrodes are stacked alternately. The monolithic structure ensures superior mechanical strength and high reliability. Also, outstanding frequency characteristics such as low ESR and lo | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Commercial Grade ( General (Up to 50V) ) C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Ceramic Capacitors For General Use SMD Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
Ceramic Capacitors For General Use SMD Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Ceramic Capacitors For General Use SMD Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
Ceramic Capacitors For General Use SMD Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc | TDK 东电化 | | ||
MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de | TDK 东电化 | |
C100产品属性
- 类型
描述
- 型号
C100
- 功能描述
电线导管 Raceway Kit
- RoHS
否
- 制造商
Panduit
- 类型
Slotted SideWall Open finger design wiring cut
- 材料
Polypropylene
- 颜色
Light Gray
- 外部导管宽度
25 mm
- 外部导管高度
25 mm
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
KEC |
24+ |
TO-92 |
5000 |
||||
ECEC/东晶 |
2410+ |
con |
9000 |
十年芯路!只做原装!一直起卖! |
|||
TDK(东电化) |
24+ |
N/A |
11048 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
|||
Fluke |
新 |
6 |
全新原装 货期两周 |
||||
SAGAMI |
2019+ |
0402 |
30000 |
原厂渠道,提供技术支持 |
|||
TDK |
24+ |
N/A |
10000 |
只做原装,实单最低价支持 |
|||
ALLWINN |
18+ |
LQFP-128 |
85600 |
保证进口原装可开17%增值税发票 |
|||
ANAREN |
22+ |
QFP |
8000 |
原装正品支持实单 |
|||
TDK |
24+ |
SMD0402 |
1110000 |
专营被动元器件原装现货 |
|||
TDK/东电化 |
2021 |
SMD |
66558 |
现货库存一站式配套元器件 |
C100芯片相关品牌
C100规格书下载地址
C100参数引脚图相关
- ca1558
- ca1458
- ca139
- ca121
- c960
- c903
- c9012
- c901
- C80
- c62f
- c430p
- c3055
- c3000
- c2073
- c20001
- c2000
- c188
- c1209
- C107E
- C107D
- C107C
- C107B
- C107A
- C106Y
- C106Q
- C106M
- C106G
- C106F
- C106E
- C106D
- C106C
- C106B
- C106A
- C106
- C105
- C10113A
- C10108
- C10107
- C10100
- C1010
- C100S35
- C100PNP
- C-100-K
- C10080
- C1008
- C1005CH
- C1005
- C1004
- C1002
- C-1001Y
- C-1001H
- C-1001G
- C-1001E
- C1001AT
- C10017
- C1001
- C10000
- c1000
- C0981A
- C0980A
- C0979A
- C0978A
- C0977A
- C0975A
- C0974A
- C0973A
- C0972A
- C0971-A
- C0971A
- C0961A
- C0960A
- C0959A
- C0958A
- C0957A
- C0956A
- C0955A
- C0954A
- C0953A
- C-066P
- C-066
- C055P
- C055
- BZW20
- BY805A
- BY804A
- BY803A
- BY802
- BY801A
- BY703A
- BY702A
- BY701
- BY501C
- BY501B
- BY501A
- BY4959
- BY4957
- BY3500A
- BY1D
C100数据表相关新闻
C0603C104K5RAC3121
C0603C104K5RAC3121
2023-3-21C0603C112J5GACTU 多层陶瓷电容器
C0603C112J5GACTU 多层陶瓷电容器MLCC - SMD/SMT 50V 1100pF 0603 C0G 0.05
2023-3-1C1206C106K4RACTU产品中文资料
C1206C106K4RACTU产品中资料
2020-6-13C099-F9P应用板 C099-F9P-2-02
u-blox的C099-F9P应用板可通过多频段RTK轻松评估u-blox ZED-F9P
2019-12-3C1206C473M5RACTU
製造商: KEMET 產品類型: 多層陶瓷電容器MLCC - SMD/SMT RoHS: 詳細資料 終端: Standard 電容: 0.047 uF 直流電額定電壓: 50 VDC 電介質: X7R 耐受性: 20 %_ 外殼代碼 - in: 1206 外殼代碼 - mm: 3216 高度: 0.78 mm 最低工作溫度: - 55 C 最高工作溫度: + 125 C 產品: General Type MLCCs 終
2019-11-19C1093-可调节精密并联稳压器
描述 该mPC1093可调精密并联稳压器的热稳定性保证。输出电压可设置之间的任何参考电压（2.495 V）和36 V值由两个外部电阻器。这些IC可应用于开关稳压器的误差放大器。 特征 •高精度的VREF=2.495伏±2％ •低温度系数DVREF/ dt的百万分之100英镑/℃ •通过两个外部电阻器的VREF££旁白可调输出电压36伏特 •低动态阻抗| ZKA| =0.1 WTYP。 订购信
2018-12-19
DdatasheetPDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
