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C100晶体管资料

  • C100别名：C100三极管、C100晶体管、C100晶体三极管

  • C100生产厂家：印度大陆器件公司

  • C100制作材料：Ge-PNP

  • C100性质：通用型 （Uni）

  • C100封装形式：

  • C100极限工作电压：50V

  • C100最大电流允许值：1A

  • C100最大工作频率：<1MHZ或未知

  • C100引脚数：

  • C100最大耗散功率：0.75W

  • C100放大倍数：

  • C100图片代号：NO

  • C100vtest：50

  • C100htest：999900

  • C100atest：1

  • C100wtest：0.75

  • C100代换 C100用什么型号代替：

C100价格

参考价格：￥381.3077

型号：C100 品牌：Fluke 备注：这里有C100多少钱，2025年最近7天走势，今日出价，今日竞价，C100批发/采购报价，C100行情走势销售排行榜，C100报价。
型号 功能描述 生产厂家&企业 LOGO 操作
C100

Thermometricstemperaturesensorsolutions

文件：1.44125 Mbytes Page：16 Pages

AMPHENOLAmphenol Corporation

安费诺集团美国安费诺集团

AMPHENOL
C100

SILICONPLANAREPITAXIALTRANSISTORS

文件：88.54 Kbytes Page：4 Pages

CDIL

Continental Device India Limited

CDIL
C100

封装/外壳：85-LFBGA 包装：托盘 描述：5MP H.265 USB VIDEO PROCESSOR - 集成电路（IC） DSP（数字信号处理器）

LUMISSIL

Lumissil Microsystems

LUMISSIL
C1003_C0G_SMD

SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)

Overview KEMET’sC0Gdielectricfeaturesa125°Cmaximum operatingtemperatureandisconsidered“stable.” TheElectronicsComponents,Assemblies&Materials Association(EIA)characterizesC0Gdielectricasa ClassImaterial.Componentsofthisclassificationare temperaturecompensatinga

KEMETKEMET Corporation

基美基美公司

KEMET
C1004

ProcessC1004

ProcessC1004CMOS1.0µm5VoltDigital

IMP

IMP, Inc

IMP
C1005

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005

MULTILAYERCERAMICCHIPCAPACITORSCommercialgrade,general(Upto75V)

■SERIESOVERVIEW GeneraltypeCseriesisasurface-mountedcomponent,whichmultilayerdielectricsandinnerelectrodesarestackedalternately.Themonolithic structureensuressuperiormechanicalstrengthandhighreliability.Also,outstandingfrequencycharacteristicssuchaslowESRandlo

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1A010B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1A0R5B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1A100B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1E102J050BA

CommercialGrade(General(Upto50V))

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010B

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010B050BA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010B050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010B050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H010C050BA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020B

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020B050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020B050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020B050BA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C050BA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H020C050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H030B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H030B

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H030B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H030B

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK
C1005C0G1H030B050BA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

TDK株式会社东电化（中国）投资有限公司

TDK

C100产品属性

  • 类型

    描述

  • 型号

    C100

  • 功能描述

    电线导管 Raceway Kit

  • RoHS

    否

  • 制造商

    Panduit

  • 类型

    Slotted SideWall Open finger design wiring cut

  • 材料

    Polypropylene

  • 颜色

    Light Gray

  • 外部导管宽度

    25 mm

  • 外部导管高度

    25 mm

C100供应商更多...

更新时间：2025-5-24 13:10:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
深圳市向鸿伟业电子有限公司
C10000J049
ECEC/东晶
2410+
con
9000
十年芯路!只做原装!一直起卖!
询价
深圳市科恒伟业电子有限公司
C100
全志
1942+
QFP
9852
只做原装正品现货或订货!假一赔十!
询价
深圳市科芯源微电子有限公司
C1005C0G1H1R5CT
TDK/东电化
23+
0201
100586
全新原厂原装正品现货,可提供技术支持、样品免费!
询价
深圳兆威电子有限公司
C100
22+
QFP
42896
原装正品现货
询价
深圳市万佳诚业科技有限公司
C100N50Z4A
Anaren(安伦)
23+
24+
15000
专业帮助客户找货 配单,诚信可靠!
询价
深圳市力拓辉电子有限公司
C1005X7R1C103KT000F
TDK
21+
0402
450000
全新原装鄙视假货
询价
深圳市纳艾斯科技有限公司
C1000
C
24+
SOP8
80000
只做自己库存,全新原装进口正品假一赔百,可开13%增
询价
贸泽芯城（深圳）电子科技有限公司
C1000
C
23+
SOP8
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
现代芯城（深圳）科技有限公司
C10000J049
24+
N/A
51000
一级代理-主营优势-实惠价格-不悔选择
询价
深圳市安富世纪电子有限公司
C100
全志
23+
QFP
7300
专注配单,只做原装进口现货
询价

C100芯片相关品牌

  • AMPHENOL
  • CK-COMPONENTS
  • DDK
  • GLENAIR
  • MACOM
  • Mitsubishi
  • MOLEX6
  • Panasonic
  • POWERDYNAMICS
  • RHOMBUS-IND
  • TELEDYNE
  • YAMAICHI

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