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C10晶体管资料
C100别名：C100三极管、C100晶体管、C100晶体三极管
C100生产厂家：印度大陆器件公司
C100制作材料：Ge-PNP
C100性质：通用型 （Uni）
C100封装形式：
C100极限工作电压：50V
C100最大电流允许值：1A
C100最大工作频率：<1MHZ或未知
C100引脚数：
C100最大耗散功率：0.75W
C100放大倍数：
C100图片代号：NO
C100vtest：50
C100htest：999900
- C100atest：1
C100wtest：.75
C100代换 C100用什么型号代替：
C10价格
参考价格：￥222.4007
型号：C10 品牌：Fluke 备注：这里有C10多少钱，2024年最近7天走势，今日出价，今日竞价，C10批发/采购报价，C10行情走势销售排行榜，C10报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
C10 | Miniature LCD Display DigitalPanel Meters [ACCULEX] Description TheDP-650Seriesisanultra-compact,low-powerLCDmeterrequiringonly15mWofpower.ThismeterisidealforapplicationsrequiringahighlyreliableLCDdisplayinasmallpackage.Thesnap-inbezelpackagingenableseasyandrapidinstallationofthemeter.Thesimp | ETC1List of Unclassifed Manufacturers 未分类制造商 |  |   |
C10 | 1 WATTS 100-8KV SINGLE OUTPUT DC/DC INDUSTRIAL Features •Lowripple •Miniaturesize •Regulated •0-100programmableoutput •Highstability,typically | POWERBOX Powerbox manufactures |  | |
C10 | MINIATURE, REGULATED HIGH VOLTAGE DC TO DC CONVERTERS 文件：981.25 Kbytes Page：12 Pages | XPPOWER XP Power Limited |  | |
C10 | 封装/外壳：5-DIP 模块 包装：托盘 描述：DC DC CONVERTER 1000V 1W 电源 - 板安装 直流转换器 | XPPXPPower XP Power |  | |
C10 | 封装/外壳：5-DIP 模块 包装：托盘 描述：DC DC CONVERTER 1000V 1W 电源 - 板安装 直流转换器 | XPPXPPower XP Power | | |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Overview KEMET’sC0Gdielectricfeaturesa125°Cmaximum operatingtemperatureandisconsidered“stable.” TheElectronicsComponents,Assemblies&Materials Association(EIA)characterizesC0Gdielectricasa ClassImaterial.Componentsofthisclassificationare temperaturecompensatinga | KEMETKEMET Corporation 基美基美公司 |  | | |
Process C1004 ProcessC1004CMOS1.0µm5VoltDigital | IMP Electric Imp Inc. |  | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 |  | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Commercial grade, general (Up to 75V) ■SERIESOVERVIEW GeneraltypeCseriesisasurface-mountedcomponent,whichmultilayerdielectricsandinnerelectrodesarestackedalternately.Themonolithic structureensuressuperiormechanicalstrengthandhighreliability.Also,outstandingfrequencycharacteristicssuchaslowESRandlo | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Commercial Grade ( General (Up to 50V) ) CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Ceramic Capacitors For General Use SMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Ceramic Capacitors For General Use SMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Ceramic Capacitors For General Use SMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Ceramic Capacitors For General Use SMD Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYER CERAMIC CHIP CAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
Multilayer Ceramic Chip Capacitors General use Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | |
C10产品属性
- 类型
描述
- 型号
C10
- 功能描述
测试配件 - 其他 HOLSTER
- RoHS
否
- 制造商
Tektronix
- 附件类型
Soft Case
- 颜色
Gray
- 设备类型
Transit Case
- 产品
Accessories
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK/东电化 |
21+ |
NA |
640000 |
原装现货 假一赔十 |
|||
ON |
23+ |
TO |
18000 |
||||
TDK(东电化) |
23+ |
NA/ |
8735 |
原厂直销,现货供应,账期支持! |
|||
ON(安森美) |
23+ |
标准封装 |
9048 |
全新原装正品/价格优惠/质量保障 |
|||
新电源 |
2022+ |
TO-263 |
7300 |
原装现货 |
|||
NEC |
1950+ |
BGA |
6852 |
只做原装正品现货!或订货假一赔十! |
|||
Amphenol |
2301+ |
端子 |
10000 |
全新、原装 |
|||
NIEC |
04+ |
TO-263 |
1744 |
||||
MAXIM |
SMD-20 |
6000 |
原装现货,长期供应,终端可账期 |
||||
RCL |
2023+ |
晶源 |
8800 |
正品渠道现货 终端可提供BOM表配单。 |
C10芯片相关品牌
C10规格书下载地址
C10参数引脚图相关
- ca1558
- ca1458
- ca139
- ca121
- c960
- c903
- c9012
- c901
- C80
- c62f
- c430p
- c3055
- c3000
- c2073
- c20001
- c2000
- c188
- C1366C2
- C1363CA
- C1356C2
- C1353H2
- C1330P
- C1253H2
- C1252H2
- c1209
- C1156H
- C1-1004
- C1-1003
- C1-1002
- C1062P
- C1058P
- C1057P
- C1053P
- C1052P
- C1046P(HEP)
- C1046P
- C1045P
- C1044P
- C10113A
- C10108
- C10107
- C10100
- C1010
- C100S35
- C100PNP
- C-100-K
- C10080
- C1008
- C1005CH
- C1005
- C1004
- C-1001Y
- C-1001H
- C-1001G
- C-1001E
- C1001AT
- C10017
- C10000
- c1000
- C0G1850
- C0G1702
- C0G1428
- C0981A
- C0980A
- C0979A
- C0978A
- C0977A
- C0975A
- C0974A
- C0973A
- C0972A
- C0971-A
- C0971A
- C0961A
- C0960A
- C0959A
- C0958A
- C0957A
- C0956A
- C0955A
- C0954A
- C0953A
- C0912P
- C0911P
- C0910P
- C0909P
- C0908P
- C0907P
- C0906P
- C0905P
- C0904P
- C0903P
- C0902P
- C0901P
- C0900P
- C060612
- C060474
- C017097
- C014806-03
C10数据表相关新闻
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C1206C106K4RACTU产品中资料
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u-blox的C099-F9P应用板可通过多频段RTK轻松评估u-bloxZED-F9P
2019-12-3C1206C473M5RACTU
製造商:KEMET 產品類型:多層陶瓷電容器MLCC-SMD/SMT RoHS:詳細資料 終端:Standard 電容:0.047uF 直流電額定電壓:50VDC 電介質:X7R 耐受性:20%_ 外殼代碼-in:1206 外殼代碼-mm:3216 高度:0.78mm 最低工作溫度:-55C 最高工作溫度:+125C 產品:GeneralTypeMLCCs 終
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描述该mPC1093可调精密并联稳压器的热稳定性保证。输出电压可设置之间的任何参考电压（2.495V）和36V值由两个外部电阻器。这些IC可应用于开关稳压器的误差放大器。特征•高精度的VREF=2.495伏±2％•低温度系数DVREF/dt的百万分之100英镑/℃•通过两个外部电阻器的VREF££旁白可调输出电压36伏特•低动态阻抗|ZKA|=0.1WTYP。订购信
2018-12-19
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