OVERVIEW

The BCM5703 is a fully integrated 10/100/1000BASE-T Gigabit Ethernet media access control and physical layer transceiver solution for high performance network applications. The BCM5703 is a highly integrated solution combining a triple-speed, IEEE 802.3 compliant media access controller (MAC), PCI and PCI-X bus interfaces, an onchip buffer memory, and an integrated physical layer transceiver in a single device. The BCM5703 is fabricated in a low-voltage, 0.13-µm CMOS process providing a low-power system solution. The BCM5703 provides a complete single-chip Gigabit Ethernet NIC or LOM solution.

• Single-chip solution for LAN on Motherboard (LOM) and network interface card (NIC) applications

• Integrated 10BASE-T/100BASE-TX/1000BASE-T transceivers

• 10/100/1000 triple-speed MAC

• Host interfaces

- PCI v2.2—32/64 bits, 33/66 MHz

- PCI-X v1.0—64 bits, 66/100/133 MHz

• Ultra-deep 96-KB on-chip packet buffer

• Dual high-speed RISC cores with 16-KB caches

- Programmable, in-line packet classification

• SMBus 2.0 controller

• On-chip power circuit controller and Wake on LAN (WOL) power switching circuit

• Performance features:

• TCP, IP, UDP checksum

• TCP segmentation

• CPU task offload

• Adaptive interrupts

• Ultra-deep 96-KB packet buffer

• Robust manageability:

• PXE 2.0 remote boot

• Alert Standard Format—ASF 1.0 support

• Wake on LAN

• Out-of-box (OOB) Wake on LAN

• Intelligent platform management interface (IPMI), version 1.5

• Statistic gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB)

• Comprehensive diagnostic and configuration software suite

• ACPI 1.1a compliant multiple power modes

• Advanced network features:

• Priority queuing—802.1p layer 2 priority encoding; support for four priority queues

• Virtual LANs—802.1q VLAN tagging; support for up to 64 VLANs

• Jumbo frames (9 KB)

• 802.3x flow control

• Advanced server features:

• Link aggregation—802.3ad, GEC/FEC, Smart Load Balancing™ (supports heterogeneous teams)

• Heterogeneous, mixed-speed failover

• PCI Hot-Plug support

• Low-power, 0.13-um CMOS design

• 400-pin FBGA package

• 3.3V I/Os (5V tolerant)

• JTAG