DISCRIPTION

Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip chip attachment. Their unique construction yields extremely low capacitance and inductance parasitics critical for these high-speed applications.

FEATURES

• Integrated resistor and capacitor network

• High density packaging

• High temperature solder balls

• Industry standard ball diameter and pitch

• Excellent high frequency performance