FEATURES

● Low profile package

● For surface mounted applications

● Built-in strain relief, ideal for automated placement

● Plastic package has underwriters, laborator flammability classification 94V-0

● High temperature soldering: 250°C/10 seconds at terminals

MECHANICAL DATA

● Case :JEDEC SMA, molded plastic over ,passivated chip

● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026

● Polarity: color band denotes cathode end

● Weight: 0.002 ounces, 0.064 gram