200 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates

Surface Mount Zener Diodes

Features ● Planar Die Construction ● Ultra-Small Surface Mount Package ● Ideally Suited for Automated Assembly Processes

200mW, 5 Tolerance SMD Zener Diode

FEATURES - Wide zener voltage range selection : 2.4V to 75V - Surface Mount Device Type - VZ Tolerance Selection of ±5 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Moisture sensitivity level 1 - Pb free and RoHS compliant - Green compound (Halogen free) with suffix G on pack

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-Q101 Standards for High Reliabi

200mW SURFACE MOUNT ZENER DIODE

Features ● Planar Die Construction ● 200mW Power Dissipation ● 2.0V – 51V Nominal Zener Voltage ● 5 Standard Vz Tolerance ● Designed for Surface Mount Application ● Plastic Material – UL Recognition Flammability Classification 94V-0

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

ZENER DIODE

SOD-323 Plastic-Encapsulate Diodes FEATURES ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version

Surface mount zener diode

Features • Planar die construction. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package.SOD-323

ZENER DIODE

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

ZENER DIODE

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

PLASTIC-ENCAPSULATE ZENER DIODE

VOLTAGE 2.0~75 Volts POWER 200.0 mW FEATURES • Low Zener Impedance • Power Dissipation of 200mW • High Stability and High Reliability • Zener Voltage Tolerance: ± 5 MECHANICAL DATA • Case: SOD-123 Small Outline Plastic Package • Epoxy UL: 94V-0 • Polarity: Color band denotes cathode end

200mW SURFACE MOUNT ZENER DIODE

Features: Power dissipation: Pd: 200mW (tamb=25°C) Forward Voltage: Vf: 0.9V Operating and storage junction temp. range: Tj, Tstg: -55°C to +150°C

200 mW Zener Diode 2.4 to 39 Volts

Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates

Surface Mount Silicon Zener Diodes

FEATURES ● Ideally suited for automated assembly processes. ● Total power dissipation: Max. 200mW

Planar Die Construction

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

Plastic-Encapsulate Diodes

Plastic-Encapsulate Diodes FEATURES Planar die construction General purpose, Medium current Ideally suited for automated assembly processes Available in Lead free version

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

SURFACE MOUNT SILICON ZENER DIODES

Features: • Planar Die Construction • 200mW Power Dissipation • 2.4-51V Nominal Zener Voltage • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testin

Plastic-Encapsulate Zener Diode

Features ● Low Zener Impedance ● 200mW; Power Dissipation of 200mW ● High Stability and High Reliability

Surface mount zener diode

FEATURES ● Planar die construction. ● General purpose, medium current. ● Ideally suited for automated assembly processes. APPLICATIONS ● Zener diode. ● Ultra-small surface mount package.

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

Zener Diodes

■ Features ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version

SURFACE MOUNT ZENER DIODES

FEATURES Planar die construction 200mW power dissipation on ceramic PBC General purpose, medium current Ideally suited for automated assembly processes Available in lead free version

SOD-323 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction General Purpose, Medium Current 200mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes Available in Lead Free Version

封装/外壳：SC-76，SOD-323 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：ZENER DIODE 5.6V 0.2W SOD-323 分立半导体产品 二极管 - 齐纳 - 单

封装/外壳：SC-76，SOD-323 包装：卷带（TR） 描述：DIODE ZENER 5.6V 200MW SOD323 分立半导体产品 二极管 - 齐纳 - 单

SURFACE MOUNT ZENER DIODE

文件：956.23 Kbytes Page：3 Pages

0.2W Zener Diode

文件：1.53972 Mbytes Page：3 Pages

SURFACE MOUNT ZENER DIODE

文件：88.9 Kbytes Page：4 Pages

5 Tolerance SMD Zener Diode

文件：247.9 Kbytes Page：5 Pages

ZENER DIODE

文件：517.13 Kbytes Page：4 Pages

200mW SOD-323 SURFACE MOUNT

文件：298.29 Kbytes Page：4 Pages

Surface mount zener diode

文件：191.5 Kbytes Page：5 Pages

200 mW Zener Diode 2.4 to 39 Volts

文件：282.09 Kbytes Page：4 Pages

SURFACE MOUNT ZENER DIODE

文件：185.21 Kbytes Page：5 Pages

ZENER DIODE

文件：237.7 Kbytes Page：3 Pages

200 mW Zener Diode 2.4 to 56 Volts

文件：272.9 Kbytes Page：4 Pages

SOD323 Plastic-Encapsulate Diodes

文件：1.89514 Mbytes Page：5 Pages

Zener Diodes

文件：1.16825 Mbytes Page：4 Pages

SURFACE MOUNT ZENER DIODE

文件：146.74 Kbytes Page：4 Pages

SURFACE MOUNT ZENER DIODE

文件：91.18 Kbytes Page：3 Pages

SURFACE MOUNT SILICON ZENER DIODES

文件：186.75 Kbytes Page：3 Pages

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

SURFACE MOUNT SILICON ZENER DIODES

SURFACE MOUNT SILICON ZENER DIODES

410 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 500mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates RoH

ZENER DIODE

Features · Constant voltage control · Wide voltage range selection 2.4V to 75V · Vz tolerance selection of ±2 (B series) · SOD-323F thin SMD package · RoHS compliant / Green EMC · Matte Tin (Sn) lead finish · Cathode band

SURFACE MOUNT ZENER DIODE

DESCRIPTION The UTC BZT52CXXXS is surface mount zener diode. it uses UTC’s advanced technology to provide the customers with low leakage current, etc. The UTC BZT52CXXXS is suitable for automated assembly processes, etc. FEATURES * Low leakage current

SURFACE MOUNT ZENER DIODE

DESCRIPTION The UTC BZT52CXXXS is surface mount zener diode. it uses UTC’s advanced technology to provide the customers with low leakage current, etc. The UTC BZT52CXXXS is suitable for automated assembly processes, etc. FEATURES * Low leakage current

SURFACE MOUNT ZENER DIODE

文件：91.18 Kbytes Page：3 Pages

Plastic-Encapsulated Diode

FEATURES ⚫ Planar die construction ⚫ 200mW power dissipation on ceramic PBC ⚫ General purpose, medium current ⚫ AEC-Q101 qualified

0.5W 5.6V Zener diode

文件：496.332 Kbytes Page：3 Pages