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型号 功能描述 生产厂家 企业 LOGO 操作

LES SERIES - 15 WATT

DESCRIPTION LES DC/DC converters provide up to 15 Watts of output power in an industry standard package and footprint. With a maximum case temperature of 100°C, the LES is well suited for the most demanding telecom, networking, and industrial applications. The LES features 1500 VDC isolation, sho

POWER-ONE

SCRs

General Description The Teccor line of thyristor SCR semi-conductors are half-wave, unidirectional, gate-controlled rectifiers which complement Teccors line of sensitive SCRs. Teccor offers devices with ratings of 1 A to 70 A and 200 V to 1000 V, with gate sensitivities from 10 mA to 50 mA. If ga

TECCOR

MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY

DESCRIPTION The STA015 is a fully integrated high flexibility MPEG Layer III Audio Decoder, capable of decoding Layer III compressed elementary streams, as specified in MPEG 1 and MPEG 2 ISO stand ards. The device decodes also elementary streams compressed by using low sampling rates, as specif

STMICROELECTRONICS

意法半导体

MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY

DESCRIPTION The STA015 is a fully integrated high flexibility MPEG Layer III Audio Decoder, capable of decoding Layer III compressed elementary streams, as specified in MPEG 1 and MPEG 2 ISO stand ards. The device decodes also elementary streams compressed by using low sampling rates, as specif

STMICROELECTRONICS

意法半导体

MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY

DESCRIPTION The STA015 is a fully integrated high flexibility MPEG Layer III Audio Decoder, capable of decoding Layer III compressed elementary streams, as specified in MPEG 1 and MPEG 2 ISO stand ards. The device decodes also elementary streams compressed by using low sampling rates, as specif

STMICROELECTRONICS

意法半导体

BGA-FC-015产品属性

  • 类型

    描述

  • 型号

    BGA-FC-015

  • 制造商

    ABL Components

  • 功能描述

    HEAT SINK BGA FLIP-CHIP 11/W

  • 制造商

    ABL Components

  • 功能描述

    HEAT SINK, BGA, FLIP-CHIP, 11C/W

  • 制造商

    ABL Components

  • 功能描述

    HEAT SINK, BGA, FLIP-CHIP, 11C/W, Packages

  • Cooled

    BGA, Thermal

  • Resistance

    11C/W, External Height -

  • Imperial

    0.945", External Height -

  • Metric

    24mm, External Width -

  • Imperial

    1.575", External Width -

  • Metric

    40mm, External Length - , RoHS

  • Compliant

    Yes

更新时间:2026-7-31 22:50:02
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
SAMSUNG
23+
ZIP
6500
全新原装假一赔十
IPD
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IPD
23+
MODULE
13000
原厂授权一级代理,专业海外优势订货,价格优势、品种
IPD
NA
8560
一级代理 原装正品假一罚十价格优势长期供货
LES010ZE-3
25+
74
74
POWERONE
24+
MODULE
8540
只做原装正品现货或订货假一赔十!
SAMSUNG
26+
ZIP
9526
代理全系列销售, 全新原装正品,价格优势,长期供应,量大可订
原厂
2023+
模块
600
专营模块,继电器,公司原装现货
IPD
25+
NA
880000
明嘉莱只做原装正品现货
IPD
23+
模块
900
全新原装正品,量大可订货!可开17%增值票!价格优势!

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