Multi-channel System Power Supply ICs for Small to Middle PANEL

BD8163EFV是用于TFT面板的系统电源IC。它把TFT面板需要的逻辑电压、源极电压、栅极High Low电压合计4路电压内置于一个芯片，能够通过最小的应用方案构成TFT面板电源。 •1ch 内置FET的升压DC/DC\n•2.5-V 稳压器\n•正负charge pumps\n•栅极补偿功能;

5V Input Multi-channel System Power Supply ICs

文件：562.24 Kbytes Page：22 Pages

封装/外壳：24-VSSOP（0.220"，5.60mm 宽）裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC SYSTEM POWER SUPPLY 24HTSSOP 集成电路（IC） 电源管理 - 专用

5V Input Multi-channel System Power Supply ICs

文件：562.24 Kbytes Page：22 Pages

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES

DESCRIPTION The µPC8106TB and µPC8109TB are silicon monolithic integrated circuit designed as frequency up-converter for cellular/cordless telephone transmitter stage. The µPC8106TB features improved intermodulation and µPC8109TB features low current consumption. From these two version, you can c

SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conv

SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR TELEPHONE

DESCRIPTION The µPC8163TB is a silicon monolithic integrated circuit designed as frequency up-converter for cellular telephone transmitter stage. The µPC8163TB has improved intermodulation performance and smaller package. The µPC8163TB is manufactured using NEC’s 20 GHz fT NESATTMlll silicon bip

LED Displays Numeric 7-segment

文件：295.65 Kbytes Page：7 Pages

SILICON RFIC HI-IP3 FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

文件：121.05 Kbytes Page：8 Pages