Features & Benefits

➤ maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling

➤ maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB

➤ Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards

➤ Comes preassembled with high performance, phase changing, thermal interface material

➤ Designed for standard height components from 3 to 4.5mm