位置：021100IL02XNH > 021100IL02XNH详情
021100IL02XNH中文资料
021100IL02XNH数据手册规格书PDF详情
FEATURES
Dissipates elevated live steam temperature
Rugged design for direct mounting
Reduces process temperature to protect attached instrument
更新时间：2025-10-12 11:10:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PACKTE |
23+ |
BGA |
5000 |
原厂授权代理,海外优势订货渠道。可提供大量库存,详 |
|||
PACKTE |
16+ |
BGA |
2500 |
进口原装现货/价格优势! |
|||
PACKET |
23+ |
BGA1152 |
50000 |
全新原装正品现货,支持订货 |
|||
PACKET |
10+ |
BGA1152 |
6 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
PACKET |
2023+ |
BGA1152 |
8800 |
正品渠道现货 终端可提供BOM表配单。 |
|||
PACKTE |
24+ |
BGA |
20000 |
只做正品原装现货 |
|||
PACKET |
25+ |
BGA |
880000 |
明嘉莱只做原装正品现货 |
|||
PACKET |
24+ |
BGA |
54000 |
郑重承诺只做原装进口现货 |
|||
MeasurementSpecialtiesSe |
24+ |
原厂原装 |
6000 |
进口原装正品假一赔十,货期7-10天 |
|||
TE |
2022 |
连接器 |
10000 |
全新、原装 |
021100IL02XNH 资料下载更多...
021100IL02XNH 芯片相关型号
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- 021100I02XNH
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- 02401PTI02T
- 02401PTI04T
- CLA0330002BBCG
- CLA0330002BBEG
- CLA0330002BFCG
- CLA0330002BFEG
- CLA0330002BNEG
- CLA0330002CBCG
- CLA0330002CBEG
- CLA0330002CFCG
- CLA0330002CFEG
- CLA0330002CNEG
- CLA0330002DBCG
- CLA0330002DFCG
- CLA0330002DFEG
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