FEATURES

 For surface mounted applications in order to optimize board space

 Typical maximum temperature coefficient △VBR=0.1%xVBR@25°C x△T

 Low profile package

 Built-in strain relief

 Glass passivated junction

 Excellent clamping capability

 Repetition Rate (duty cycle):0.01%

 Fast response time: typically less than 1.0ps from 0 Volts to BV

 Meet MSL1 Level, per J-STD-020, LF maximum peak of 260 ℃

 Plastic package has Underwriters Laboratory Flammability 94V-0

 Matte Tin Lead-free plated