FEATURES

* Thermal conductivity: 1.5W/m.k

* Low pressure applications

* Natural tack

* Electrical insulating

* High temperature resistance

* 100 Lead (Pb)-free and RoHS Compliant

DESCRIPTION

ATCR1R5 series thermal pad is a special compound formed

by mixing the silicon gel flour and the ceramic flour. This

pad has natural weak adhesion on both sides and presents

good thermal conductivity and electrical insulation under low

pressure. ATCR1R5 series can work stably at

-40～150ºC. The flame rating is UL94 V0.

With good thermal conductivity, wide temperature range and

low price, this pad could be a cost-effective one.