Features:

—Package: white SMT package, colored silicone resin

—Chip technology: InGaN on Sapphire

—Typ. Radiation: 120° (Lambertian emitter)

—Color: Cx = 0.35, Cy = 0.35 acc. to CIE 1931 (● white)

—Corrosion Robustness Class: 1B

—Color temperature: 4000K - 8000K

—CRI: 80 (min.)

—ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)