Features

- Package: white SMT package, colorless clear resin

- Chip technology: InGaAlP

- Typ. Radiation: 120° (Lambertian emitter)

- Color: λdom = 606 nm (● orange)

- Corrosion Robustness Class: 3B

- Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Qualification for Automotive Grade Discrete Semiconductors.

- ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)