Features

- Package: white SMT package, colored diffused silicone resin

- Chip technology: ThinGaN

- Typ. Radiation: 120° (Lambertian emitter)

- Color: Cx = 0.33, Cy = 0.33 acc. to CIE 1931 (● white)

- Corrosion Robustness Class: 1B

- Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Qualification for Automotive Grade Discrete Semiconductors.

- ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)